Qualcomm’s lofty ambitions of hitting high clock speeds on its flagship chipsets like the Snapdragon 8 Elite Gen 5 come at the cost of increased heat generation. To alleviate this massive trade-off, the company has been rumored to switch to the same cooling solution that Samsung has employed on its Exynos 2600, which is Heat Pass Block (HPB). With this inclusion, chipsets like the Snapdragon 8 Elite Gen 6 Pro can achieve frequencies of 5.00GHz without hitting a thermal wall, and we have some excellent news for you. In what could be the biggest leaks of the year, we get our first look at the Snapdragon 8 Elite Gen 6 Pro schematic, revealing several details, including the use of HPB.
More details reveal that the Snapdragon 8 Elite Gen 6 Pro will feature Package-on-Package memory, with two lanes of UFS 5.0 storage, and more
Shortly after revealing details that the Snapdragon 8 Elite Gen 6 Pro will provide support for various DRAM and storage standards to help Qualcomm’s partners mitigate component costs, Fixed-focus digital cameras has returned with one of the biggest leaks of the year, showcasing the SoC’s schematic. Based on what we can see, Samsung’s HPB is shown in the image below as the Heat Slug Sheet, with the passive cooler placed directly on top of the chipset packaging to help keep temperatures low.
For those who don’t know, HPB acts as a heatsink that’s placed directly on top of the chipset die to help transfer heat more effectively. On traditional designs, the DRAM was placed on top of the SoC, but this would give the silicon less breathing room, resulting in temperatures climbing at a rapid pace. Other details, such as ‘Package on Package’ memory, with support for 4 x 24-bit LPDDR6 RAM, or 4 x 16-bit LPDDR5X RAM, are also displayed.
There’s also the mention of UFS 5.0 storage, which uses up two bandwidth lanes. Given that the Snapdragon 8 Elite Gen 6 Pro will be no slouch in the performance department, it should provide multi-monitor support to boost productivity, similar to what Samsung has done with its DeX solution. With this leak out in the open, we have confidence that Qualcomm will be one of the early adopters of Samsung’s Heat Pass Block technology.
For now, let us keep our fingers crossed that this implementation finally addresses the overheating problems on the Snapdragon 8 Elite Gen 6 Pro. As for the standard Snapdragon 8 Elite Gen 6, there’s no confirmation if it will be treated to HPB.
News Source: Fixed-focus digital cameras
Follow Wccftech on Google to get more of our news coverage in your feeds.
First Appeared on
Source link
Leave feedback about this